TE0821-01-3BE21ML

Product information “MPSoC Module with AMD Zynq™ UltraScale+™ ZU3EG-1E, 2 GByte DDR4, low profile”

The predecessor of this article is TE0821-01-3BE21FL. All changes are in the Product Change Notification (PCN).

Important: Information for all serial numbers greater than 867995.

This module is identical to variant TE0821-01-3BE21MA except the lower 2.5 mm Samtec connectors.

The Trenz Electronic TE0821-01-3BE21ML is an industrial-grade MPSoC module with low profile board to board connectors integrating a AMD/Xilinx Zynq™ UltraScale+™ ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O’s is provided via rugged high-speed stacking connections.

This module is pin compatible with Trenz Electronic TE0820 MPSoC modules (JM2 pin 100 is not connected).

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

Key Features

  • AMD/Xilinx Zynq™ UltraScale+™ XCZU3EG-1SFVC784E
  • ZU3EG, 784 Pin Packages
    • Application Processor: Quad-Core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Graphics Processor: Mali-400 MP2
    • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface
      • DisplayPort source-only interface with video resolution up to 4k x 2k
      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 34 x High Performance und 96 x High Density PL I/Os
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
    • 4 x serial PS GTR transceivers
  • Rugged for shock and high vibration
  • Graphic Processing Unit (GPU)
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 2 GByte DDR4 SDRAM, 32-Bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC Memory (up to 64 GByte)
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • MAC address serial EEPROM with EUI-48 node identity
  • Hi-speed USB2 ULPI transceiver with full OTG support
  • All power supplies on board
  • Evenly spread supply pins for good signal integrity
  • size: 4 x 5 cm

Other assembly options for cost or performance optimization plus high volume prices available on request.

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